PCB Business Introduction
Our goal is to train first-class employees, manufacture first-class products, build first-class enterprises, and jointly contribute to the development of the electronic industry
Quality raw material guarantee
All FR4 raw materials use Kingboard and Shengyi Military A-level panels. Imported ink ensures clear solder mask printing and full color.
Quality management system certification
The factory has complete ISO9001, ISO14001, ISO16949, ISO13485, UL and other quality management system certifications.
Wide product coverage
The products cover consumer electronics, military industry, medical equipment, industrial control equipment, automobile manufacturing, and other fields.
Fast delivery
Design + production one-stop service, seamless docking, greatly shortening the customer development cycle.
Front-end technical guidance
Our company has a senior design team that can provide front-end technical guidance, review and reference suggestions for customers’ designs to avoid the risk of design errors.
PCB Process Capability
| Item | Sample | Batch |
|---|---|---|
| Minimum line width & space | 3/3mil | 3/3mil |
| Impedance control | ±5% | ±10% |
| Maximum copper thickness | 12oz | 12oz |
| Maximum Aspect ratio | 10:01 | 10:01 |
| Maximum board size | 610mm X 1100mm | 610mm X 1100mm |
| Item | Sample | Batch |
|---|---|---|
| Number of layers | 1-48 L | 2-30 L |
| Board thickness | 0.13-6.0mm | 0.2-6.0mm |
| Minimum mechanical aperture | 0.15mm | 0.2mm |
| Minimum laser aperture | 4mil | 4mil |
| HDI type | 1+n+1、2+n+2、3+n+3 | 1+n+1、2+n+2 |
| Item | Sample | Batch |
|---|---|---|
| Material | CEM-3、FR4(High Tg. Halogen Free), Rogers, Teflon, Arlon, Metal Base | FR4/Hi-Tg/Rogers/Halogen Free/RCC/PTFE/Nelco/Mixed Material |
| Surface Treatment | Immersion Gold, HASL, LF-HAL, OSP, Immersion Tin, Immersion Silver, Gold Finger, Carbon | Immersion Gold, HASL, LF-HAL, OSP, Immersion Tin, Immersion Silver, Gold Finger, Carbon |
| Special | Resin plug hole, VIP, HDI, IC Bonding | Resin plug hole, VIP, HDI, IC Bonding |
PCB Production Cycle
| Layer | Batch | Sample | Urgent |
|---|---|---|---|
| 2layers | 7days | 4days | 2days |
| 4layers | 12days | 5days | 3days |
| 6layers | 13days | 10days | 4days |
| 8layers | 15days | 15days | 7days |
| 10layers | more then 30days | 18days | 7days |
| 12layers | more then 30days | 18days | 7days |
| 14layers | more then 30days | 18days | 7days |
| 16layers | more then 30days | 18days | 7days |
| Layer | Batch | Sample | Urgent |
|---|---|---|---|
| 18layers | more then 30days | 18days | 7days |
| 20layers | more then 30days | 18days | 7days |
| 22layers | more then 30days | 18days | 7-14days |
| 24layers | more then 30days | 18days | 7-14days |
| 26layers | more then 30days | 18days | 7-14days |
| 28layers | more then 30days | 18days | 7-14days |
| 30layers | more then 30days | 18days | 7-14days |
| 32layers | more then 30days | 18days | 7-14days |
PCB Equipment
